Large and flexible semi-automatic rework system for soldering and unsoldering electronic components on PCBs. Guided rework for large boards up to 530 x 610 mm with eight bottom radiator heating zones and motorized X/Y fine adjustment and component rotation (top operation with resolution less than 20 µm).
Rework Technology:
- Gentle heating technology
- Sensor guided soldering processes
- Contactless residual solder removal
- Precise component placement
English 
French