SMD Assembly
Our investment in state-of-the-art equipment allows us to meet our customers needs for timing and cost efficiency while maintaining the reputation of precision and quality associated with Swiss workmanship.
RAMI SWISS’s pick-and-place line offers the perfect balance of speed and agility. With equipment capable of placing 40,000 CPH, we can easily support high volume production runs. For low volume and prototype runs, our operators can quickly switch to batch size runs with minimal down time.
Our facility is set up to accommodate a wide range of PCBA requirements and is ideal for customers looking for both Swiss precision and value.
THT Assembly
For production of boards that require large components and precision, our selective solder equipment provides accurate placement on boards up to 508 x 508 mm while minimizing deposition of flux. Equipped with all-over preheating, our process ensures reproducible and efficient placement for even the most complex components.
3D AOI
When it comes to quality and precision, there is no substitute for 3D AOI. The advantage of 3D inspection is that it provides volumetric height information in order to accurately inspect height sensitive devices. AOI is programmed to inspect components to their acceptable tolerances which is faster and more reliable than 2D inspection.
Our In-line AOI machine provides fifteen mega pixel CoaXPress Camera Technology, Advanced Eight Phase Color Lighting System, and Integrated Ten Mega Pixel SIDE-VIEWER® Camera System.
AOI/Function Test
Device Assembly
RAMI Swiss combines PCBA assembly with RAMI’s (R.A. Miller Industries, Inc.) heritage for vertical integration and manufacturing to provide full-turn-key assembly of customers looking for a one-stop-shop for circuit board production and product integration. Our manufacturing capabilities allow the customer to focus on development without the burden of standing up a full rate production line.
Rework
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